Technology Advances
FAST’s use-inspired research plan harnesses AI for better semiconductor chip design and manufacturing. Initial research projects aim to revolutionize one or more aspects of semiconductor design or manufacturing in the following areas of innovation:
- Rapid development of next generation extreme ultra-violet resists.
- Improved decision-making and yield for AI-enabled metrology and test.
- High-level synthesis with significant reduction in AI chip design time.
- Efficient AI-enabled electronic design automation for fully automatic chip design.
- Optimized thermal management for 3D chip packaging.
Research Ecosystem
FAST coordinates outstanding resources representing the breadth of research expertise in the region through committed collaborations among university and industry partners.
Three universities lead
INNOVATIVE RESEARCH in collaboration with industry partners:
- R1 university and the 7th largest engineering college in the nation.
- Collaborative semiconductor research spanning areas from design to packaging.
- Long history in preparing students for semiconductor careers.
- R2 University.
- State-of-the-art facilities for nanotechnology and microelectronics.
- Comprehensive educational offerings for semiconductor workforce development.
- R1 university.
- Accelerating discoveries and innovation across semiconductors, advanced materials and devices, and metrology.
- Training the semiconductor workforce with programs that engage corporate partners.
INDUSTRY RESEARCH LEADERS
PROVIDE SUPPORT, GUIDANCE, AND DIRECTION including companies like HP, Inpria, Intel, Lam Research, Siemens, Synopsys, Tektronix, Teradyne.
Key Partners
ADVOCATE FOR REGIONAL COLLABORATION including non-profit organizations like the Technology Association of Oregon and the Silicon Forest Partnership.